Smart Card Bonding & Chip Encapsulation
Smart cards are used in a number of industries today including: banking, retail, telecommunications, security, health records, transportation and government services. Lumen Dynamics spot UV curing products can be used in several smart card bonding applications including wire bond encapsulation, chip underfill, die attach, chip-on-board encapsulation and antenna tacking.
Features |
Benefits |
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OmniCure® S2000 contains Closed-Loop Feedback |
Ensuring a repeatable dose |
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High Power Fiber Light Line provides a high output linear beam of curing energy |
Ideal for use in applications such as edge bonding and provides more efficient transmission and can lower the cost of operation |
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Specific irradiance levels can be set |
Minimizes heating and allows precise control |
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R2000 Radiometer used to calibrate the OmniCure® S2000 |
Set output level on multiple systems wirelessly |
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The OmniCure® S2000 system includes two I/O ports and RS-232 communication for controlling the system remotely |
The curing system can be easily integrated into an automated system minimizing development time |
